Manufacturing

Alorium Technology offers contract electronics manufacturing for low-volume and prototype production builds.

This service now extends beyond our Fusion Product Development clients to include any customer looking for a flexible, quick-turn manufacturing partner for small-quantity PCB assembly production.

Manufacturing Capabilities – At A Glance

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Mancorp MC-300 Auto Pick and Place

Vision-inspected pick and place
PCB offset/misalignment correction
Up to 1800 CPH

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Mancorp MC-301 Reflow Oven

Programmable reflow profiles
9.84” x 7.87” (250 mm x 200 mm) soldering area capacity

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Manual Flows

Solder Stenciling
Visual Inspection
Bring-Up Debug and Rework

General Guidelines

Board / Panel 

  • Minimum 1.0 inch in at least one direction
  • Maximum 200 mm x 300mm
  • Minimum 100 mil holes at each of 4 corners
  • Board or panel must include fiducials

Parts Handling

  • Minimum 0402 component size
  • Minimum 0.5 mm pad pitch for QFPs/QFNs/BGAs
  • Maximum 28×28 mm part size
  • 9 mm max component height

Board Edge Minimums

  • Frameless boards: 40 mils
  • Framed panels: No restriction
  • Require frame between the component and panel edge

Stencil Requirements

  • Framed stainless steel stencil
  • Maximum 18 in x 18 in
  • Minimum 9 in x 9 in
  • Minimum 10 mil x 10 mil square openings

Alorium Technology Snō Build

The original catalyst for adding production capabilities was the decision to start manufacturing our own boards starting in 2020.

The video below shows a small build of our Snō FPGA modules in September 2020.

Fusion Case Study | AT10

DFM Guidelines

Click on the button below to download an overview of the Alorium Technology production and assembly Design for Manufacturability (DFM) guidelines.

DFM Guidelines

Click on the button below to download an overview of the Alorium Technology production and assembly Design for Manufacturability (DFM) guidelines.

Interested in Manufacturing?

Alorium Technology is an Intel Design Solutions Network Provider